G2-Gyroscope: MEMS gyroscope with output oscillation about the normal to the plane

ABSTRACT

A gyroscope that lies generally in a plane, for detecting rotation rate about a gyro input axis. The gyroscope has a substrate, and a generally planar support member flexibly coupled to the substrate such that it is capable of oscillatory motion about a drive axis that is orthogonal to the input axis. There is also a generally planar gyro member coplanar with and flexibly coupled to the support member such that it is capable of rotary oscillatory motion relative to the support member about an output axis that is orthogonal to the plane of the members. There are one or more drives for directly or indirectly oscillating the gyro member about the drive axis, and one or more gyro output sensors that detect oscillation of the gyro member about the output axis.

CROSS REFERENCE TO RELATED APPLICATION

This application claims priority of provisional application Ser. No. 60/694,161 filed on Jun. 27, 2005, the entirety of which is incorporated herein by reference.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH

This invention was made with government support under contract number F08630-03-C-0149 issued by AFRL/MNGN, Eglin AFB. The government has certain rights in this invention.

FIELD OF THE INVENTION

This invention relates to MEMS gyroscope designs.

BACKGROUND OF THE INVENTION

The G2-Gyroscope is a Coriolis gyroscope where the drive and output sense motions are angular oscillations. Its structure is planar and composed of two members: a Gyro Member and a Drive Member. The Gyro Member is the gyro. The Drive Member supports the Gyro Member above the substrate and is used to oscillate the Gyro Member about the Drive Axis, without applying direct actuation to the Gyro Member. Under rotation rate input, the Gyro Member responds by oscillating about the Output Axis (orthogonal to the Drive Axis). The Input Axis and Drive Axis are orthogonal to each other and lie in the plane of the gyroscope. The Output Axis is aligned normal to the plane. An attribute of this design is that the Gyro Member can be made symmetric about the Output Axis and therefore reduce sensitivity to cross-axis rotation rate inputs. By using the Drive Member to indirectly drive the Gyro Member, error torques are minimized.

SUMMARY OF THE INVENTION

The inventive G2-Gyroscope design is a planar MEMS instrument intended for integration into a planar MEMS Inertial Measurement Unit (IMU) whereby gyroscopes and accelerometers, formed onto a single substrate, sense all six-degrees-of-freedom. The G2-Gyroscope is also operational on its own.

This invention relates to designs of the G2-Gyroscope.

This invention further relates to planar G2-Gyroscope designs capable of being fabricated with MEMS processing technologies.

This invention further relates to the symmetry of the Gyro Member about the Output Axis to reduce sensitivity to cross-axis rotation rates.

This invention further relates to the indirect drive of the Gyro Member through a Drive Member (DM), to which the Gyro Member is attached. The purpose is to minimize unwanted drive of the Gyro Member about the Output Axis (quadrature source).

This invention further relates to the components of the design and how they provide functionality to operate the gyroscope.

This invention also relates to the alternate design where the Gyro Member is larger and driven directly to oscillate about the Drive Axis. The larger size of the Gyro Member increases gyroscope sensitivity. In this case, the member that supports the gyro member relative to the substrate is not driven, and thus is not really a “Drive Member.” This member may thus be generally termed, for both preferred embodiments, a “support member.”

This invention also relates to the operation of the G2-Gyroscope. Although the gyroscope can be operated with any set of Drive Member and Gyro Member (also referred to as Inner Member) natural frequencies, the sensitivity is improved as the difference between them (offset) is reduced. Operation with an offset of zero is the most sensitive and represents a special case.

This invention also relates to the monolithic construction of the gyro to minimize structural instability. The structure is electrically connected to ground.

BRIEF DESCRIPTION OF THE DRAWINGS

Other objects, features and advantages will occur to those skilled in the art from the following descriptions of the preferred embodiments, and the accompanying drawings, in which:

FIGS. 1A and B are stick figures representing the inventive G2-Gyroscope design structure.

FIG. 2 is a graph of the Gyro signal dependence with offset frequency.

FIG. 3 is a top view of one embodiment of the inventive G2-Gyroscope mechanical design.

FIG. 4 is a close up view of the W-flexure of the G2-Gyroscope of FIG. 3.

FIG. 5 is a close up view of the rotary comb design of the gyro of FIG. 3.

FIG. 6 shows the differential alignment between rotary comb quadrants of the rotary comb shown in FIG. 5.

FIG. 7 is a schematic representation of the G2-Gyro metallization design for the embodiment of FIGS. 3-6.

FIG. 8 is a top view of an alternative preferred embodiment of the invention, showing a G2-Out Gyroscope mechanical design.

FIG. 9 is a schematic representation of the metallization design for the G2-Out Gyro embodiment of FIG. 8.

FIG. 10 is a schematic diagram of the preferred electronics for operation of the inventive G2-Gyroscope.

FIG. 11 schematically depicts the dissolved wafer process steps for the preferred manner of fabricating the inventive gyro.

FIG. 12 is a schematic side-view of the completed device from FIG. 10 after the silicon is etched by EDP.

DESCRIPTION OF THE PREFERRED EMBODIMENTS OF THE INVENTION Design Guidelines

The design of one preferred embodiment of the invention incorporates:

-   -   a symmetric disk (Gyro Member or “GM” herein) in the plane of         the instrument that is driven to oscillate about an axis in the         plane (Drive Axis), by the use of an outer structure, the Drive         Member; the gyro output motion is the oscillation of the disk         about the axis normal to the plane (Output Axis); the purpose of         the symmetric disk is to reduce sensitivity to cross-axis         rotation rate,     -   the disk is mounted to the Drive Member (DM) so that the drive         of the disk about the Drive Axis is accomplished through the DM         structure and actuation is not applied directly to the disk         itself; the purpose is to minimize the inadvertent drive of the         disk about the Output Axis,     -   the Drive Member is connected with a pair of torsional flexures         to bonding pads attached to the substrate,     -   a mesa between the bonding pads and the substrate provides the         working gap that allows motion of the GM and DM about the drive         axis,     -   a set of radial flexures suspends the disk from the Drive Member         and allow its oscillation about the Output Axis,     -   each radial flexure incorporates stress reliefs to minimize the         DM stress imparted on the disk that affects its free motion,     -   actuation of the Drive Member is done with two sets of capacitor         plates located underneath the DM and on both sides of the Drive         Axis,     -   motions of the disk and Drive Member are sensed with capacitive         pick-offs that operate differentially to cancel common-mode         noise; at zero rotation rate, the difference in capacitance is         zero and the output is zero,     -   the mechanical structure consists of two moving members cut from         one material (monolithic construction); the fill structure is         connected electrically to ground (or common potential),     -   the monolithic structure is mounted onto a rigid substrate onto         which are also located the stators for driving (actuating) and         sensing the motion of the members,     -   the rigid substrate provides a stable base for the gyroscope and         maintains its alignment,     -   the Pyrex base is a material that enables anodic bonding of the         epitaxial silicon to the Pyrex; its electrical insulation         property separates the gyroscope from other devices that may be         located on the same substrate,     -   the thickness of the gyroscope structure is sufficiently large         that the members oscillate as thin plates with little structural         distortion, and     -   the working gap is large enough to prevent stiction to the         substrate.

Modeling

G2-Gyroscope Structure

The G2-Gyro structure is based on two nested members that oscillate in angle about orthogonal axes defined by two sets of flexures as shown in FIGS. 1A and 1B. The inner member (IM) is called the Gyro Member (GM) and the outer member (OM) is called the Drive Member (DM). The Gyro Member is mounted with flexures to the Drive Member and rotates by angle θ relative to the Drive Member. The DM is mounted to the case (substrate) with flexures and rotates by angle φ relative to the case (substrate). Since the gyroscope is an oscillatory device, the angles θ,φ are small. The two sets of flexures define axes of rotation that are orthogonal. There are three co-ordinate axes that apply; the first, (s,i,o ) is fixed to the Gyro Member; the second, (x,y,z) is fixed to the Drive Member and the third, (a,b,c) is fixed to the case and rotates in inertial space. The case angles of rotation are not limited. The Gyro Member equation of motion describes the motion of the GM under rotation in inertial space and describes the output of the gyro.

Equation of Motion

Analysis is used to derive the equation of motion for the Gyro Member when the Drive Member is oscillated at some frequency and amplitude as the Case undergoes rotation in inertial space. The resultant equation of motion is given by

$\begin{matrix} {{{I_{GM}\overset{¨}{\vartheta}} + {D_{GM}\overset{.}{\vartheta}} + {\left\lbrack {K_{GM} + {\left\{ {\left( {\Omega_{b}^{2} - \Omega_{a}^{2}} \right) + {\frac{1}{2}\left( {\omega^{2} - \Omega_{c}^{2}} \right){\overset{\sim}{\phi}}^{2}} - {2\Omega_{a}\Omega_{c}\overset{\sim}{\phi}\sin\;\omega\; t} + {2\Omega_{b}\overset{\sim}{\phi}\omega\;\cos\;\omega\; t}} \right\}\Delta\; I}} \right\rbrack\vartheta} - {\left( {{\Omega_{a}\Omega_{b}} + {\Omega_{a}\Omega_{c}\overset{\sim}{\phi}\sin\;\omega\; t} + {\Omega_{a}\overset{\sim}{\phi}\omega\;\cos\;\omega\; t}} \right)\vartheta^{2}}} = {{I_{GM}\Omega_{a}\overset{\sim}{\phi}\omega\;\cos\;\omega\; t} - {\Delta\;{I\left( {{\Omega_{a}\Omega_{b}} + {\Omega_{b}\Omega_{c}\overset{\sim}{\phi}\sin\;\omega\; t} + {\Omega_{a}\overset{\sim}{\phi}\omega\;\cos\;\omega\; t}} \right)}}}} & (1) \end{matrix}$ where

I_(GM): GM moment of inertia about the o-axis (Output Axis)

D_(CM): GM damping

K_(GM): GM flexure stiffness (spring constant)

θ: rotation angle of the GM relative to the DM

φ: DM rotation angle relative to the case

Ω_(a), Ω_(b), Ω_(c): rotation rates of the case in inertial space about three axes

ΔI=I_(i)−I_(s): difference of GM inertias about the i-axis and s-axis

φ={tilde over (φ)} sin(ωt): DM oscillatory angular motion

{dot over (φ)}=ω{tilde over (φ)} cos ωt: rate of DM angular motion

To the left of the equals sign are included the torque terms dependent on inertia, damping and stiffness as well as a nonlinear (fourth) term dependent on GM angle squared. The stiffness (third) term is given by

$\begin{matrix} \left\lbrack {K_{GM} + {\left\{ {\left( {\Omega_{b}^{2} - \Omega_{a}^{2}} \right) + {\frac{1}{2}\left( {\omega^{2} - \Omega_{c}^{2}} \right){\overset{\sim}{\phi}}^{2}} - {2\Omega_{a}\Omega_{c}\overset{\sim}{\phi}\sin\;\omega\; t} + {2\Omega_{b}\overset{\sim}{\phi}\omega\;\cos\;\omega\; t}} \right\}\Delta\; I}} \right\rbrack & (2) \end{matrix}$

The stiffness term includes a constant flexure stiffness, K_(GM), and a component dependent on vehicle rotation rates, Ω_(a), Ω_(b), Ω_(c), DM drive frequency, ω, and a factor referred to as the tuning inertia, ΔI.

On the right of the equals sign are given terms that drive the GM. They include a gyroscope torque due to rotation rate about the Input Axis and others due to case rotation about cross-axes that are coupled by the tuning inertia They are respectively: I_(GM) Ω_(a){tilde over (φ)}ω cos ωt and ΔI(Ω_(a)Ω_(b)+Ω_(b)Ω_(c){tilde over (φ)} sin ωt+Ω_(a){tilde over (φ)}ω cos ωt). G2-Gyro Mechanization/Mechanical Response

From the equation of motion, the gyroscope operation is simplified by making the GM symmetric about the o-axis (Output Axis) so that ΔI=0. The resultant equation of motion becomes I _(GM) {umlaut over (θ)}+D _(GM){dot over (θ)}+K _(GM)θ=I _(GM)Ω_(a){tilde over (φ)}ω cos ωt  (3) The interpretation is that of a simple harmonic GM oscillator driven externally by a gyroscopic torque that results from the oscillatory motion of the DM and input rotation rate. Rewriting the GM EOM in the “Standard Form”, we get

$\begin{matrix} {{{\overset{¨}{\vartheta}\; + \;{2\;\xi\;\omega_{GM}\;{\overset{\;.}{\vartheta}\;}}\; + \;{\omega_{GM}^{2}\;\vartheta}}\; = \;{{\overset{\sim}{\phi}(\omega)}\;{\omega\Omega}_{a}\;\cos\;\omega\; t}}{where}{{2\;{\;\xi_{GM}}\;\omega_{GM}}\; = \;{D_{GM}/I_{GM}}}{\xi_{GM}\; = \;{\frac{1}{2}\;\frac{D_{GM}}{I_{GM}\;\omega_{GM}}}}} & (4) \end{matrix}$

ξ_(GM) is the GM damping factor, and

$\begin{matrix} {{\omega_{GM}^{2} = {K_{GM}/I_{GM}}}{\omega_{GM} = \sqrt{\frac{K_{GM}}{I_{GM}}}}} & (6) \end{matrix}$ where ω_(GM) is the GM natural frequency.

The solution describes the oscillatory motion of the GM in response to gyroscope input rotation rate, and is given by θ(t)={tilde over (θ)} sin(ωt−ε _(GM))  (7) where {tilde over (θ)} is the GM oscillatory amplitude and ε_(GM) is the GM oscillation phase relative to the gyroscopie drive.

$\begin{matrix} {{\overset{\sim}{\vartheta}(\omega)} = \frac{\frac{I_{GM}}{K_{GM}}\Omega_{a}\omega{\overset{\sim}{\phi}(\omega)}}{\left\lbrack {\left( {2\xi_{GM}\frac{\omega}{\omega_{GM}}} \right)^{2} + \left( {1 - \frac{\omega^{2}}{\omega_{GM}^{2}}} \right)^{2}} \right\rbrack^{1/2}}} & (8) \\ {{ɛ_{GM}(\omega)} = {\tan^{- 1}\left( \frac{2\xi_{GM}\frac{\omega}{\omega_{GM}}}{1 - \frac{\omega^{2}}{\omega_{GM}^{2}}} \right)}} & (9) \end{matrix}$

These solutions can be plotted to obtain the Transfer Functions or Bode of the GM. Note that the response is also dependent on the DM amplitude, which also varies with angular frequency (the GM is coupled to the DM).

Practical Gyroscope Case—Offset Operation

For the practical gyroscope, the DM is driven at resonance to minimize the drive voltage and to maximize the DM oscillation amplitude. The GM response then depends on the GM and DM natural frequencies (note that the DM comprises the gyro disk for purposes of calculating the DM inertia about the Drive Axis and the DM natural frequency). The maximum DM amplitude and phase at resonance are given by

$\begin{matrix} {{{\overset{\sim}{\phi}\left( \omega_{DM} \right)} = \frac{{\overset{\sim}{\Gamma}}_{DM}}{D_{DM}\omega_{DM}}}{{ɛ\left( \omega_{DM} \right)} = \frac{\pi}{2}}} & (10) \\ {{where}{\Gamma_{DM} = {\frac{V^{2}}{2}\frac{\delta\; C}{\delta\phi}}}} & (11) \end{matrix}$ is the torque applied by the capacitive actuator. The GM responses for amplitude and phase for GM and DM natural frequencies are

$\begin{matrix} {{\overset{\sim}{\vartheta}}_{Out} = {{\overset{\sim}{\vartheta}\left( \omega_{DM} \right)} = \frac{\frac{I_{DM}}{K_{DM}}{\Omega\omega}_{DM}{\overset{\sim}{\phi}\left( \omega_{DM} \right)}}{\left\lbrack {\left( {2\xi_{GM}\frac{\omega_{DM}}{\omega_{GM}}} \right)^{2} + \left( {1 - \frac{\omega_{DM}^{2}}{\omega_{GM}^{2}}} \right)^{2}} \right\rbrack^{1/2}}}} & (12) \\ {{ɛ_{GM}\left( \omega_{Dm} \right)} = {\frac{\pi}{2} + {\tan^{- 1}\left( \frac{2\xi_{GM}\frac{\omega_{DM}}{\omega_{GM}}}{1 - \frac{\omega_{DM}^{2}}{\omega_{GM}^{2}}} \right)}}} & (13) \end{matrix}$ Matched Frequency Case: Zero Offset

The maximum sensitivity is obtained for the case in which the DM and GM resonances are matched, ω_(DM)=ω_(GM). The output per rotation rate input (Scale Factor) then is given by

$\begin{matrix} {{\overset{\sim}{\vartheta}}_{matched} = {\frac{I_{GM}}{D_{GM}}\overset{\sim}{\phi}\Omega_{a}}} & (14) \end{matrix}$

The output amplitude is dependent directly on the GM inertia, inversely with damping and directly with DM oscillation amplitude. A vacuum is necessary to develop the proper damping. In this case, it can readily be seen that the gyro sensitivity scales with size and inversely with damping.

General Offset Description

Gyro sensitivity is dependent on the separation (offset) between the GM and DM natural frequencies. In FIG. 2 is plotted the modeled dependence for a typical gyro case. The top curve is of the DM amplitude φ(f_(DM)) and it is held constant. The lower curve is of the GM amplitude response for an input rotation rate of 1 rad/sec. Its amplitude θ(f_(DM)) depends on the DM frequency and it increases as the offset is reduced.

G2-Gyro Requirements

-   -   the DM is driven at resonance to the maximum amplitude possible         as limited by the working gap between the device and the         substrate,     -   a phase-lock loop is used to maintain the operation of the DM at         resonance,     -   the DM amplitude is held constant with an amplitude control         loop,     -   the DM-GM frequency offset is held constant,     -   excitation frequencies for operating the DM and GM capacitive         sensors need to be sufficiently different to minimize pick-up         between them,     -   GM and DM oscillation axes are orthogonal to prevent drive of         the GM by the DM oscillation, and     -   DM actuation is done without actuating the GM directly.         G2-Gyro Operation

The DM is driven at some frequency and amplitude about the Drive Axis. When the gyro is rotated about the Input Axis (orthogonal to both the Drive Axis and Output Axis), the GM responds with an oscillation amplitude that is proportional to the Input Rotation Rate. Demodulation of the oscillatory output with a reference waveform at the same frequency and with the appropriate phase generates a gyro output DC voltage proportional to the Input Rotation Rate.

G2-Gyro Quadrature

A signal that is in “quadrature” with the gyro signal is an error signal generated by the improper operation of the gyroscope and the gyroscope design. Fortunately it is always out of phase by 90 degrees with the gyro signal and can be separated and filtered by proper demodulation. The phase of the demodulation reference waveform is to be controlled to prevent leakage of the quadrature signal into the gyro signal channel.

G2-Gyroscope Embodiment

Mechanical Design

The mechanical design of one preferred embodiment of the inventive G2-Gyroscope 10 is shown in FIG. 3. The rectangular shapes on each end are bonding pads 12, 13 used to bond the device to the Pyrex substrate 14. Two torsional flexures 16, 17 connect the Drive Member 18 to the bonding pads. The flexures are stress-relieved by the oval cutouts 20, 21 in the bonding pads. The square DM shape allows the placement of sufficiently large capacitive plates underneath for actuation, Sense plates are used to measure the motion of the DM. The Gyro Member 22 is an annular disk connected to the DM with four W-shaped flexures 24, 25, 26, 27. The W-flexure design 42 shown in FIG. 4 is made up of two U-shaped flexures 43, 44. One end of each is connected to the DM 45 and the other to the GM disk 46 through L-shaped segments 47, 48 essentially tangent to the disk curvature. The L-shaped segment is added to enable the U-structure to bend with GM rotation and to absorb stress between the DM and GM. The radial alignment of the flexures along diagonals across the DM makes a symmetric arrangement with each flexure experiencing the equivalent stress.

The working gap between the gyro structure and the Pyrex substrate is 10 microns but the gap used depends on several factors: geometry, actuation capacity, sensitivity and fabrication constraints. The gap is fabricated by etching a well in the silicon and a well in the Pyrex.

The use of Pyrex is dependent on the need to anodically bond epitaxial silicon to a substrate as described below in the DWP process. Other processes are possible. It is preferred to use a substrate that has similar thermal characteristics to the device material, which in this case is silicon. An option is to also use silicon as the substrate for a close thermal match and to enable anodic bonding with a deposited Pyrex-equivalent film added to the substrate silicon. This would also preserve the electrical isolation between devices on the same substrate.

It is preferred for the device to be monolithic for mechanical stability and to connect it to electrical ground.

On the inside diameter of the GM is constructed a radial comb 30 for sensing the rotation of the GM. The comb teeth are aligned radially with the GM center of rotation. Four sets of mating combs are constructed on four separate quadrants fixed separately to the substrate that serve as stators for the moving comb rotor on the GM. By connecting the bonding pads to traces, the silicon structure is connected to electrical ground.

The gyro is driven by actuation of the DM about the Drive Axis 4. The Output Axis 5 is normal to the plane of the DM. The Input Axis 6 is orthogonal to the other two.

Rotary Comb Capacitive Sensor

The rotary comb design 30 is illustrated in FIG. 5. It is separated into four quadrants 32, 33, 34, 35. For each quadrant, the comb is divided into a stator with stator comb fingers 36 attached to the substrate 14 and a rotor with rotor comb fingers 38 that are part of the moving GM disk structure 40. The stator fingers and rotor fingers are aligned radially with the center of rotation of the disk. For each rotor finger there is a stator finger with the two separated by a small gap. They make up a comb finger pair. Pairs of comb fingers are separated by a large gap. A number of comb finger pairs makes up each quadrant. The sensitivity of the comb sensor scales with the number of comb finger pairs. By reducing the small gap between the comb finger pairs, the sensitivity is increased.

Neighboring quadrants 33, 34 are designed symmetrically about the axis that separates them as shown in FIG. 6. For rotation of the rotor in either direction, the small gap 37 of comb finger pairs in one quadrant decreases while the small gap of comb finger pairs in the other quadrant increases. The purpose of the rotary design, based on neighboring quadrants, is that when the signals from the comb finger pairs located on neighboring quadrants are differenced, the signals add and the common-mode noise subtracts; this is differential operation. At zero rotation of the GM, the output is also zero. When the output from the third and fourth quadrants are added to the first and second, the signal is doubled again. This is the preferred operation of the rotary comb of the gyro for maximum sensitivity.

Alternate uses of the rotary comb are possible if one set of neighboring quadrants is connected for rotary sensing and the other set for actuation. One use is to test the operation of the Gyro Member separately. The second use is to cancel quadrature error by adding a counter motion of the Gyro Member.

Metallization Design of the G2-Gyroscope

The metallization design 50 is shown in FIG. 7. It consists of capacitive plates, conductor traces and pads. Capacitive plates 51 and 52 are located under part of the DM on one side of the Drive Axis. They are connected by a trace. Capacitive plates 53, 54 are located on the other side. They are connected by a trace. Drive voltages are applied to the actuator plates to predominantly pull down on one side of the DM during the first half of the drive cycle and to predominantly pull down on the other side of the DM during the second half of the drive cycle. The result is an oscillatory motion of the DM about the Drive Axis. The sensing of the DM motion is accomplished with two capacitive plates 55, 56. The outputs are connected differentially, since for any motion, the gap for one increases and the gap for the other decreases.

Trace 57 connects capacitive plates 53, 54 to pad 58, for example.

Stators of the rotary comb are connected to pads with traces 59 that are crimped between the stator structure and the Pyrex substrate during anodic bonding. The monolithic gyro structure containing the GM and DM is connected to pads by traces 63, 64 crimped between the mounting structures 61, 62 and the Pyrex substrate. The preferred electrical connection of the gyro structure is to ground.

Traces are also capacitive sensing plates when they are located beneath the moving structure and this needs to be taken into consideration. A rule is to make the lengths under the moving parts equal and symmetric. Pick-up between plates and traces is also a consideration. The usual design practices apply. Electrical pick-up can be a source of quadrature in the gyro output.

Flexures

The purposes of flexures are to:

-   -   set orientational alignment between members,     -   govern rotation of the members about prescribed axes, and     -   provide support for the members of the structure.

The orientational alignment between members is an especially important consideration for the gyroscope because misalignment introduces mechanical coupling between the DM oscillation and the Gyro Member and will generate quadrature error The ideal flexure allows only motion about one axis in the dynamic environment.

The support capability is especially important when considering shock capability. It depends on the masses of the members and the spring stiffness of the flexures. Modeling is used to identify the strain on the flexures. A maximum strain level less than one tenth the fracture limit is a good condition to set

DM Flexure Relief Structure

The stress relief absorbs the tension on the flexure that is due to the differential thermal contraction as the Pyrex and silicon cool from the elevated anodic bonding temperature. The stress can cause a potato-chip deformation of the DM that affects the GM suspended from it.

IM Flexure

The W-flexure enables rotation of the GM about the axis normal to the plane. Four are used in this design. Each W-flexure is composed of two bending U-flexures with a stress relief in each. For cases where the DM applies a tension or compression to the W-flexure, the stress relief can bend and absorb the stress. In this way, the flexure does not kink and inhibit rotation of the GM.

G2-Out Gyroscope—Alternative Preferred Embodiment

The G2-Out Gyroscope 70, FIGS. 8 and 9, is a variation on the G2-Gyroscope where the Gyro Member 80 is the structural outer member, and the Gyro Member is driven directly about the Drive Axis 84. The Output Axis is still normal to the plane. The alignments of the Drive Axis and Input Axis 85 are as specified with the G2 Gyroscope.

Mechanical Design of the G2-Out Gyroscope

The mechanical design of the G2-Out gyro embodiment of the invention is described with FIG. 8. The gyro is mounted to the Pyrex substrate 71 via the mounting post 72 in the center. Ring structure 73 is attached to central post 72 with four radial flexures 74. The radial flexures allow oscillation of the gyro about the Output Axis (normal to the plane). From the ring is attached the rotor 75 of the capacitive rotary comb sensor. The fingers of the rotor extend radially towards the center of rotation. Four radial comb stators 76, 77, 78, 79 are mounted to the Pyrex substrate. The fingers of each stator extend outwards in between the rotor fingers. The radial comb sensor design is identical to the component used for the G2-Gyro.

The ring structure 73 is connected to the disk 80 with two torsional flexures 82, 83. These flexures allow oscillation of the GM about the Drive Axis.

Metallization Design of the G2-Out Gyroscope

The metallization design is similar to that of the G2-Gyro. Plates located beneath the GM disk are used to actuate and sense the motion of the disk about the Drive Axis. Unlike the G2-Gyro, however, the GM is driven directly by the actuator plates. This can lead to direct drive of the disk about the Output Axis (quadrature error). The benefit is that the disk of the G2-Out Gyro is much larger, allowing for greater sensitivity since the inertia is greater.

The metallization design 90 is shown in FIG. 9. It consists of capacitive plates, conductor traces and pads. Capacitive plates 91 and 92 are located under part of the GM disk on one side of the Drive Axis. They are connected by a trace. Capacitive plates 93, 94 are located on the other side. They are connected by a trace. Drive voltages are applied to the actuator plates to predominantly pull down on one side of the disk during the first half of the drive cycle and to predominantly pull down on the other side of the disk during the second half of the drive cycle. The result is an oscillatory motion of the GM disk about the Drive Axis. The sensing of the GM disk motion about the Drive Axis is accomplished with two capacitive plates 95, 96. The outputs are connected differentially since for any motion, the gap for one increases and the gap for the other decreases.

Trace 97 connects capacitive plates 91, 92 to pad 98, for example.

Stators of the rotary comb are connected to pads with traces 99 that are crimped between the stator structure and the Pyrex substrate during anodic bonding. The monolithic gyro structure is connected to pad 66 by trace 67 crimped between the mounting structure 72 and the Pyrex substrate. The preferred electrical connection of the monolithic gyro structure is to ground.

Traces are in themselves capacitive sensing plates when they are located beneath the moving structure and this needs to be taken into consideration. A rule is to make the lengths under the moving parts equal and symmetric. Pick-up between plates is also a consideration. The usual design practices apply. Electrical pick-up can be a source of quadrature in the gyro output.

G2-Out Gyro Operation

For the operation of the G2-Out Gyro, the GM is oscillated about the Drive Axis. With Input Rate applied about the Input Axis, the GM disk also oscillates about the Output Axis. The rotary comb sensor measures the output motion of the GM.

Description of Preferred Electronics

The preferred electronics for the various embodiments of the invention can be described schematically with FIG. 10. An oscillator generates an AC voltage with a frequency close to the DM resonant frequency. The AC voltage is added to a DC bias voltage greater than the AC amplitude to develop a sinusoidal drive waveform. The drive voltage is applied to a set of capacitor plate actuators to drive the DM into oscillation. A set of capacitor plates under the DM is used to sense the motion of the DM about the Output Axis. A Phase-lock loop acts on the phase of the DM signal to keep the DM on-resonance by varying the oscillator frequency. An amplitude control loop compares the DM signal voltage to a reference voltage and varies the AC drive voltage to maintain the DM amplitude constant.

Input rotation rate generates an oscillation of the Gyro Member about the Output Axis with an amplitude that is proportional to the rotation rate. By demodulating the AC output signal with a reference waveform, the gyro output is converted to a DC voltage that is proportional to rotation rate. The gyroscope is operated open-loop.

Dissolved Wafer Processing

Dissolved Wafer Processing (DWP) is a MEMS fabrication process for making relatively large parts with good flatness and square profiles. The process requires two wafers: the first Pyrex and the second silicon, with a Boron-doped epitaxial layer. The combination of materials enables the two wafers to be anodically bonded. The thickness of the epitaxy determines the final device thickness, while Boron doping of the epitaxial layer inhibits EDP etching.

Typical dimensions include: device size of about 3 mm in the plane, device thickness of 40 microns, smallest flexure thickness of 5 microns and gaps between comb fingers of 5 microns.

Four process masks are needed: two for processing the silicon and two for the Pyrex. Instrument functions are distributed between the two layers: the mechanical structure and stator comb components are fabricated in the doped silicon layer and the electrical connections and flat capacitive plate components are deposited onto the Pyrex layer.

Process Steps

The process steps are described with FIG. 11. The starting silicon wafer includes a grown epitaxial layer with heavy boron diffusion of 43-micron thickness. In step 1, the epitaxial layer is etched to form mesas that support the silicon structures on the Pyrex as patterned by Mask 1. The mesa thickness also sets part of the gap between the device and the substrate that allows motion of parts. In step 2, deep reactive ion etching is used to etch through the epitaxial layer to form the device geometry that includes the structure, mass and combs as patterned with Mask 2. In step 3, wells are formed in the Pyrex to form the rest of the required gap using Mask 3. With Mask 4 (step 4), metal deposited on the Pyrex is patterned to form capacitive plates for driving and sensing out of plane motions. In addition, it patterns traces (conductors) that connect the structure, capacitive plates and the comb stators to the pads. In step 5, the silicon wafer is anodically bonded to the Pyrex wafer at the mesas. In step 6 the wafer is cut with a saw along outlines (streets) that separate devices. Each device is then EDP (Ethylene-Diamene-Pyrocatechol) etched to remove the silicon, leaving behind epitaxial devices with movable parts. The thickness of the devices is equal to the epitaxial thickness minus the mesa thickness, approximately 40 microns for the present devices. A conceptual side view of the finished device is shown in FIG. 12.

Advantages/Disadvantages of DWP

DWP has several advantages:

-   -   devices are made of one material (doped silicon) for greater         thermal stability,     -   Pyrex serves as a robust substrate since it can be made as thick         as desired,     -   multiple devices can be fabricated on the same Pyrex substrate,         while making them physically separate,     -   thicker doped silicon devices can be made subject to the         epitaxial process,     -   the process is a relatively low-temperature process, thereby         generating low internal stresses.

The disadvantages of DWP are not limiting, but can contribute to cost of fabrication and greater design complication. They include:

-   -   epitaxial growth limits the device thickness and introduces         stresses,     -   chemical etching of most of the silicon wafer by EDP,     -   induced stresses from differential expansion of the silicon and         Pyrex from the anodic bonding operation, and     -   reactive ion etching produces some tapering which makes it         difficult to attain a desired resonant frequency.

A particularly critical requirement is the formation of flexures with precise geometry having a rectangular cross-section. A small variation in the wall verticality can greatly affect the stiffness and hence the dynamics. A conical cross-section would also have the effect of changing the rotation axis of the GM, and perhaps the orthogonality between the DM and GM axes. This misalignment leads to “quadrature error” in gyroscopes.

Derivation of the Equation of Motion

The analysis prescribed by J. S. Ausman (G. R. Pitman, Jr., Editor, Inertial Guidance, University of California Engineering and Physical Sciences Extension Series, J. Wiley and Sons, Inc., New York, 1962, J. S. Ausman, ch. 3) for the gimbal structure of the Single-Degree-of-Freedom Gyroscope is applicable to the common structure of the G2-Gyro.

The fundamental equation applied is that the rate of change of angular momentum is equal to the applied torque:

$\begin{matrix} {\overset{\_}{L} = \left( \frac{\mathbb{d}\overset{\_}{H}}{\mathbb{d}t} \right)_{I}} & (15) \end{matrix}$

This is Newton's second law in rotational form. In equation (15) (d H/dt)_(I) is the time rate of change of H, the angular momentum vector, with respect to inertial space, while L represents the applied torque vector. When equation (15) is applied to the GM we get

$\begin{matrix} {\left( \frac{\overset{\_}{\mathbb{d}H_{GM}}}{\mathbb{d}t} \right)_{I} = {{\left( \frac{\overset{\_}{\mathbb{d}H_{GM}}}{\mathbb{d}t} \right)_{GM} + {\overset{\_}{\omega} \times \overset{\_}{H_{GM}}}} = \overset{\_}{L_{GM}}}} & (16) \end{matrix}$ where H_(GM) is the angular momentum of the GM,

$\left( \frac{\overset{\_}{\mathbb{d}H_{GM}}}{\mathbb{d}t} \right)_{GM}$ is the time derivative of H_(GM) relative to the s,i,o coordinate system, and ω is the angular velocity of the GM or s,i,o coordinate system in inertial space.

The GM angular momentum, H_(GM) , is given by H _(GM) ={dot over (I _(GM))}· ω  (17) where ŝ is a unit vector in the s direction. I_(GM) is the moment of inertia tensor of the GM. Calculate ω

Since the GM is mounted to the DM, which is mounted to the case, the angular velocity of the GM in inertial space is given by the angular velocity of the GM gimbal, measurable relative to the DM, plus the motion of the DM, measurable relative to the case, plus the motion of the case. This is expressible as a vector sum of the separate angular velocities ω= ω _(s,i,o)+{right arrow over (ω)}_(x,y,z)+ ω _(a,b,c) ={dot over (θ)}ô+{dot over (φ)} _(x) {circumflex over (x)}+{dot over (φ)} _(y) ŷ+{dot over (φ)} _(z) {circumflex over (z)}+{dot over (γ)} _(a) â+{dot over (γ)} _(b) {circumflex over (b)}+{dot over (γ)} _(c) ĉ  (18) where θ,φ,γ are angles of rotation for the GM, DM and case (or vehicle) axes, respectively. {dot over (θ)} relates that the motion of the GM is only about the o-axis. Further, we expect that the motion of the DM will only be about the y-axis, therefore, ω={dot over (θ)}{dot over (o)}+φ _(y) ŷ+{dot over (γ)} _(a) â+{dot over (γ)} _(b) {circumflex over (b)}+{dot over (γ)} _(c) ĉ  (19) The motion of the vehicle is unconstrained in inertial space.

Since we are interested in the motion of the GM in the s,i,o frame, we need to convert the latter terms in equation (19). We know the relationship between the s,i,o and x,y,z frames is a rotation about the o-axis. We apply the rotational transformation: {circumflex over (x)}=ŝ cos θ−î sin θ≅ŝ−îθ ŷ=î cos θ+ŝ sin θ≅î+ŝθ  (20) {circumflex over (z)}=ô Since the GM is held at null, only small motions need to be considered, hence the small angle approximation is used.

We also know that the DM can only rotate about the y-axis, therefore the two axes are related by the rotational transformation: â={circumflex over (x)} cos φ−{circumflex over (z)} sin φ≅{circumflex over (x)}−{circumflex over (z)}φ {circumflex over (b)}=ŷ  (21) ĉ={circumflex over (x)} sin φ+{circumflex over (z)} cos φ≅{circumflex over (x)}φ+{circumflex over (z)} The DM motion is also small hence the small angle approximation is again used. Substituting the rotations (20) and (21) into (19), we get ω=ω_(s) ŝ+ω _(i) î+ω _(o) ô  (22) where ω_(s)=(θ{dot over (φ)}_(y)+{dot over (γ)}_(a)+θ{dot over (γ)}_(b)+φ{dot over (γ)}_(c)), ω_(i)=({dot over (φ)}_(y)−θ{dot over (γ)}_(a)+{dot over (γ)}_(b)−θφ{dot over (γ)}_(c)), ω_(o)=({dot over (θ)}−φ{dot over (γ)}_(a)+{dot over (γ)}_(c))  (23) Calculate H _(GM)

The moment of inertia tensor for the GM is given by

$\begin{matrix} {\overset{=}{I} = \begin{pmatrix} I_{s} & 0 & 0 \\ 0 & I_{i} & 0 \\ 0 & 0 & I_{o} \end{pmatrix}} & (24) \end{matrix}$ assuming s,i,o are the principal axes of inertia for the GM. If s,i,o are not principal axes of inertia, it will generally be most convenient first to compute the vector components of İ· ω along a set of principal axes and then to transform the vector İ· ω into the s,i,o coordinate system. We assume that our designs have the appropriate symmetries.

Multiplying equation (22) by the moment of inertia tensor (24), and substituting into equation (17) gives

$\begin{matrix} \begin{matrix} {\overset{\_}{H_{GM}} = {\overset{=}{I} \cdot \overset{\_}{\omega}}} \\ {= {\begin{pmatrix} I_{s} & 0 & 0 \\ 0 & I_{i} & 0 \\ 0 & 0 & I_{o} \end{pmatrix} \cdot \left( {{\omega_{s}\hat{s}} + {\omega_{i}\hat{i}} + {\omega_{o}\hat{o}}} \right)}} \\ {= {{I_{s}\omega_{s}\hat{s}} + {I_{i}\omega_{i}\hat{i}} + {I_{o}\omega_{o}\hat{o}}}} \end{matrix} & (25) \\ {\mspace{56mu}{= {{H_{IMs}\hat{s}} + {H_{IMi}\hat{i}} + {H_{IMo}\hat{o}}}}} & (26) \end{matrix}$ where H_(IMs)=I_(s)ω_(s), H_(IMi)=I_(i)ω_(i), H_(IMo)=I_(o)ω_(o)   (27)

Calculate ω× H _(GM)

The expression ω× H_(GM) is given by

$\begin{matrix} \begin{matrix} {{\overset{\_}{\omega} \times \overset{\_}{H_{GM}}} = {\begin{matrix} \hat{s} & \hat{i} & \hat{o} \\ \omega_{s} & \omega_{i} & \omega_{o} \\ H_{GMs} & H_{GMi} & H_{GMo} \end{matrix}}} \\ {= {{\left( {{\omega_{i}H_{GMo}} - {\omega_{o}H_{GMi}}} \right)\hat{s}} - {\left( {{\omega_{s}H_{GMo}} - {\omega_{o}H_{GMs}}} \right)\hat{i}} +}} \\ {\left( {{\omega_{s}H_{GMi}} - {\omega_{i}H_{GMs}}} \right)\hat{o}} \end{matrix} & (28) \end{matrix}$

We will restrict ourselves to the 0-axis solution since we will assume that motions of the GM about the other axes do not occur.

$\begin{matrix} {\begin{matrix} {\left( {\overset{\_}{\omega} \times \overset{\_}{H_{GM}}} \right)_{o} = {{\omega_{s}H_{GMi}} - {\omega_{i}H_{GMs}}}} \\ {= {{\omega_{s}I_{i}\omega_{i}} - {\omega_{i}I_{s}\omega_{s}}}} \\ {= {{\omega_{s}I_{i}\omega_{i}} - {\omega_{s}I_{i}\omega_{s}}}} \\ {= {\left( {I_{i} - I_{s}} \right)\omega_{s}\omega_{i}}} \end{matrix}{{\underset{\_}{Calculate}\frac{\mathbb{d}H_{GMo}}{\mathbb{d}t}} + {\left( {\overset{\_}{\omega} \times \overset{\_}{H_{GM}}} \right)_{o}\mspace{14mu}{to}\mspace{14mu}{get}\mspace{14mu}{the}\mspace{14mu}{equation}\mspace{14mu}{of}\mspace{14mu}{{motion}.}}}} & (29) \\ {{\frac{\mathbb{d}H_{GMo}}{\mathbb{d}t} + \left( {\overset{\_}{\omega} \times \overset{\_}{H_{GM}}} \right)_{o}} = {{I_{o}{\overset{.}{\omega}}_{o}} + {\left( {I_{i} - I_{s}} \right)\omega_{s}\omega_{i}}}} & (30) \end{matrix}$

Substituting for ω_(o),ω_(i),ω_(s) and adding damping and spring terms to the motion of the GM, as well as the pendulous torque, we get the full GM Equation of Motion. The variables for the angles can change in rotational or oscillatory mode or both.

$\begin{matrix} {{{I_{GMo}\overset{..}{\vartheta}} + {D_{GM}\overset{.}{\vartheta}} + {\left\lfloor {K_{GM} + {\left( {{\overset{.}{\phi}}_{y}^{2} + {{\overset{.}{\phi}}_{y}{\overset{.}{\gamma}}_{b}} - {\overset{.}{\gamma}}_{a}^{2} - {\phi{\overset{.}{\gamma}}_{a}{\overset{.}{\gamma}}_{c}} + {{\overset{.}{\phi}}_{y}{\overset{.}{\gamma}}_{b}} + {\overset{.}{\gamma}}_{a}^{2} - {\phi{\overset{.}{\gamma}}_{a}{\overset{.}{\gamma}}_{c}} - {\phi^{2}{\overset{.}{\gamma}}_{c}^{2}}} \right)\Delta\; I}} \right\rfloor\vartheta} - {\left( {{{\overset{.}{\phi}}_{y}{\overset{.}{\gamma}}_{a}} + {\phi{\overset{.}{\phi}}_{y}{\overset{.}{\gamma}}_{c}} + {{\overset{.}{\gamma}}_{a}{\overset{.}{\gamma}}_{b}} + {\phi{\overset{.}{\gamma}}_{b}{\overset{.}{\gamma}}_{c}}} \right)\vartheta^{2}}} = {{I_{GMo}\left( {{\phi\;{\overset{..}{\gamma}}_{a}} + {{\overset{.}{\phi}}_{y}{\overset{.}{\gamma}}_{a}} - {\overset{..}{\gamma}}_{c}} \right)} - {\Delta\;{I\left( {{{\overset{.}{\phi}}_{y}{\overset{.}{\gamma}}_{a}} + {{\overset{.}{\gamma}}_{a}{\overset{.}{\gamma}}_{b}} + {\phi{\overset{.}{\phi}}_{y}{\overset{.}{\gamma}}_{c}} + {{\phi.{\overset{.}{\gamma}}_{b}}{\overset{.}{\gamma}}_{c}}} \right)}}}} & (31) \end{matrix}$ Note that: φ=φ_(y), ΔI_(GM)=I_(GMi)−I_(GMs) where

-   -   θ GM rotation angle relative to the DM,     -   φ DM rotation angle relative to case,     -   γ_(a), γ_(b), γ_(c) case rotation angles.

Making substitutions for φ and {dot over (φ)}=ω{tilde over (φ)} cos ωt and {dot over (γ)}_(a)=Ω_(a), {dot over (γ)}_(b)=Ω_(b), {dot over (γ)}_(c)=Ω_(c), we get the final form for the equation of motion with all the angular rotation dependences.

$\begin{matrix} {{{I_{GMo}\overset{..}{\vartheta}} + {D_{GM}\overset{.}{\vartheta}} + {\left\lbrack {K_{GM} + {\left\{ {\left( {\Omega_{b}^{2} - \Omega_{a}^{2}} \right) + {\frac{1}{2}\left( {\omega^{2} - \Omega_{c}^{2}} \right){\overset{\sim}{\phi}}^{2}} - {2\Omega_{a}\Omega_{c}\overset{\sim}{\phi}\sin\;\omega\; t} + {2\Omega_{b}\overset{\sim}{\phi}\omega\;\cos\;\omega\; t}} \right\}\Delta\; I}} \right\rbrack\vartheta} - {\left( {{\Omega_{a}\Omega_{b}} + {\Omega_{a}\Omega_{c}\overset{\sim}{\phi}} + {\overset{\sim}{\phi}\;\sin\;\omega\; t}\; + {\Omega_{a}\overset{\sim}{\phi}\omega\;\cos\;\omega\; t}} \right)\vartheta^{2}}} = {{I_{GMo}\Omega_{a}\overset{\sim}{\phi}\omega\;\cos\;\omega\; t} - {\Delta\;{I\left( {{\Omega_{a}\Omega_{b}} + {\Omega_{b}\Omega_{c}\overset{\sim}{\phi}\sin\;\omega\; t}\; + {\frac{1}{2}\Omega_{c}\sin\; 2\omega\; t} + {\Omega_{a}\overset{\sim}{\phi}\omega\;\cos\;\omega\; t}} \right)}}}} & (32) \end{matrix}$

Specific features of the invention are shown in some drawings and not others, but this is not a limitation of the invention, the scope of which is set forth in the following claims. 

1. A gyroscope that lies generally in a plane, for detecting rotation rate about a gyro input axis that lies in the plane, comprising: a substrate defining a top surface; spaced bonding pads attached to the substrate and projecting above the top surface of the substrate; a generally planar plate support member spaced above and essentially parallel to the top surface of the substrate and flexibly coupled to the bonding pads by flexures, such that the support member is capable of oscillatory motion relative to the substrate about a drive axis that is in the plane of the support member and orthogonal to the input axis; a generally planar plate gyro member located within, coplanar with, and flexibly coupled to the support member such that the gyro member is capable of rotary oscillatory motion relative to the support member about an output axis that is orthogonal to the plane of the members in response to input rotation rate, and such that the gyro member will oscillate with the support member relative to the substrate about the drive axis, as the support member is oscillated about the drive axis; one or more support member drives for directly oscillating the support member about the drive axis, and thereby also oscillating the gyro member about the drive axis; one or more support member motion sensors that sense motion of the support member relative to the substrate about the drive axis; and one or more gyro member output sensors that detect oscillation of the gyro member relative to the support member about the output axis.
 2. The gyroscope of claim 1 in which the support member drives comprise capacitive drives.
 3. The gyroscope of claim 2 in which the support member drives and the support member sensors each comprise plates on the top surface of the substrate, below and spaced from the support member, and in which the support member drive and support member sensor plates are electrically isolated from one another.
 4. The gyroscope of claim 3 in which at least the top surface of the substrate on which the drive and sensor plates are located is electrically insulating.
 5. The gyroscope of claim 4 in which at least the top surface of the substrate on which the drive and sensor plates are located is Pyrex glass.
 6. The gyroscope of claim 1 in which there is at least one support member drive on each side of the drive axis.
 7. The gyroscope of claim 1 in which the gyro member sensors comprise capacitive sensors.
 8. The gyroscope of claim 7 in which the one or more gyro output sensors comprise a rotary comb sensor comprising sets of mating combs defined by stators coupled to the substrate and rotors coupled to the gyro member.
 9. The gyroscope of claim 8 in which the rotary comb sensor comprises four stator sectors that are symmetrically, radially arranged around the output axis and electrically isolated from one another, and a single radial rotor.
 10. The gyroscope of claim 9 comprising two pairs of diametrically opposed rotary comb sensor sectors that generate output signals, in which the output signals from the diametrically opposed sectors are added, and the summed output signals from the pairs are differenced, to increase the signal strength and reduce common-mode noise.
 11. The gyroscope of claim 1 further comprising a controller, responsive to the support member motion sensors, for maintaining the oscillation amplitude of the support member constant.
 12. The gyroscope of claim 1 in which the gyro member natural frequency for oscillation about the output axis is close to but offset from the support member plus gyro member natural frequency for oscillation about the drive axis.
 13. The gyroscope of claim 1 in which the gyro member is flexibly coupled to the support member by a plurality of gyro member flexures.
 14. The gyroscope of claim 13 in which the gyro member defines a circular perimeter, and the gyro member flexures are spaced evenly about the gyro member perimeter.
 15. The gyroscope of claim 14 in which the gyro member flexures each comprise two bending “U” flexures.
 16. The gyroscope of claim 15 in which the gyro member flexures each further comprise a stress relief feature comprising a bend in the flexure.
 17. The gyroscope of claim 1 in which the support and gyro members are both generally annular and concentric.
 18. The gyroscope of claim 1 in which the gyro member natural frequency for oscillation about the output axis is the same as the support member plus gyro member natural frequency for oscillation about the drive axis.
 19. The gyroscope of claim 1 further comprising a controller, responsive to the support member motion sensors, for controlling the support member drives such that the support member plus gyro member oscillate together about the drive axis at resonance.
 20. The gyroscope of claim 1 in which the support member is flexibly coupled to the bonding pads by a pair of colinear support member torsional flexures that each comprise a stress relief feature.
 21. The gyroscope of claim 13 in which the gyro member is coupled to the support member by flexures that are radial relative to the output axis.
 22. The gyroscope of claim 1 in which a colinear pair of flexures flexibly couple the support member to the bonding pads.
 23. The gyroscope of claim 1 in which the support and gyro members are concentric.
 24. The gyroscope of claim 23 in which the support and gyro members are both symmetric about the drive axis, and the gyro member is symmetric about the output axis.
 25. The gyroscope of claim 1 in which the support member, the gyro member and the bonding pads are made from a silicon monolith.
 26. The gyroscope of claim 25 in which the support member, the gyro member and the bonding pads are made by a dissolved wafer process.
 27. The gyroscope of claim 1 in which the support member and the gyro member are maintained at a common electrical potential.
 28. The gyroscope of claim 27 in which the common electrical potential is ground.
 29. The gyroscope of claim 1 further comprising one or more gyro member motion sensors that sense motion of the gyro member about the drive axis.
 30. The gyroscope of claim 1 in which the gyro member oscillation frequency about the output axis is the same as the support member drive frequency.
 31. A gyroscope that lies generally in a plane, for detecting rotation rate about a gyro input axis that lies in the plane, comprising: a substrate defining a top surface; a mounting post attached to the substrate and projecting above the top surface of the substrate; a generally planar plate ring member spaced above and essentially parallel to the top surface of the substrate and flexibly coupled to the mounting post by a plurality of radial flexures, such that the post is centrally located relative to the ring member; a generally planar plate gyro member located outside of, concentric and coplanar with, and flexibly coupled to the ring member with a pair of colinear torsional flexures such that the gyro member is capable of oscillatory motion relative to the plane of the ring member and relative to the substrate about a drive axis that is in the plane of the gyro member and orthogonal to the input axis, and such that the gyro member will oscillate with the ring member about the output axis; wherein the ring member together with the gyro member is capable of rotary oscillatory motion about an output axis that is orthogonal to the plane of the gyro member and ring member; one or more gyro member drives for directly oscillating the gyro member about the drive axis; one or more gyro member motion sensors that sense motion of the gyro member about the drive axis; and one or more gyro output sensors that detect oscillation of the ring member and the gyro member about the output axis.
 32. The gyroscope of claim 31 in which the ring member is generally annular.
 33. The gyroscope of claim 32 in which the gyro member is generally annular.
 34. The gyroscope of claim 31 in which the gyro member drives comprise capacitive drives.
 35. The gyroscope of claim 34 in which the gyro member drive and gyro member motion sensors each comprise plates on the top surface of the substrate, below and spaced from the gyro member, and in which the gyro member drive and gyro member motion sensor plates are electrically isolated from one another.
 36. The gyroscope of claim 35 in which at least the top surface of the substrate on which the drive and sensor plates are located is electrically insulating.
 37. The gyroscope of claim 36 in which at least the top surface of the substrate on which the drive and sensor plates are located is Pyrex glass.
 38. The gyroscope of claim 31 in which there is at least one gyro member drive on each side of the drive axis.
 39. The gyroscope of claim 31 in which the gyro output sensors comprise capacitive sensors.
 40. The gyroscope of claim 39 in which the one or more gyro output sensors comprise a rotary comb sensor comprising sets of mating combs defined by stators coupled to the substrate and rotors coupled to the ring member.
 41. The gyroscope of claim 40 in which the rotary comb sensor comprises four sectors that are symmetrically, radially arranged around the output axis and electrically isolated from one another.
 42. The gyroscope of claim 41 comprising two pairs of diametrically opposed rotary comb sensor sectors that generate output signals, in which the output signals from the diametrically opposed sectors are added and the summed output signals from the pairs are differenced, to increase the signal strength and reduce common-mode noise.
 43. The gyroscope of claim 31 in which the gyro member motion sensors that sense motion of the gyro member about the drive axis comprise capacitive plate sensors.
 44. The gyroscope of claim 43 further comprising a controller, responsive to the gyro member motion sensors, for maintaining the oscillation amplitude of the gyro member constant.
 45. The gyroscope of claim 31 in which the gyro member plus ring member natural frequency of oscillation about the output axis is close to but offset from the gyro member natural frequency of oscillation about the drive axis.
 46. The gyroscope of claim 31 in which the gyro member plus ring member natural frequency of oscillation about the output axis is the same as the gyro member natural frequency of oscillation about the drive axis.
 47. The gyroscope of claim 31 further comprising a controller, responsive to the gyro member motion sensors, for controlling the drives such that the gyro member oscillation about the drive axis is at resonance.
 48. The gyroscope of claim 31 in which the ring member is flexibly coupled to the post by four evenly spaced radial flexures.
 49. The gyroscope of claim 31 in which the ring and gyro members are both symmetric about the drive axis and the output axis.
 50. The gyroscope of claim 31 in which the ring member, the gyro member and the mounting post are made from a silicon monolith.
 51. The gyroscope of claim 50 in which the ring member, the gyro member and the mounting post are made by a dissolved wafer process.
 52. The gyroscope of claim 31 in which the ring member and the gyro member are maintained at a common electrical potential.
 53. The gyroscope of claim 52 in which the common electrical potential is ground.
 54. The gyroscope of claim 31 in which the ring member and gyro member oscillation frequency about the output axis is the same as the gyro member drive frequency. 